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EL5423 V362C 8TRPB FE3A10 BCW71 NJM567 DTC115E TYNX4006
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  Datasheet File OCR Text:
 PL
IA
Features

NT
HIGH PERFORMANCE TERMINATION NETWORK Miniaturized circuitry and packaging for space reduction Designed for gigabit communication networks
CO
M

*R
oH
Controlled impedance RoHS compliant*
S
CAT16-PC2F6 - Concave Chip Array
Electrical Characteristics
Resistance R1 .............................................100 ohms R2 .............................................187 ohms Tolerance ............................................1 % TCR........................................200 ppm/ C Temperature Range .........-55 C to +125 C Max. Operating Voltage ....................5 VDC Max. Power Resistance ................ .0625 W Solderability .....................>95 % Coverage
Product Dimensions
8
.60 .10 (.024 .004) .45 .10 (.018 .004)
7
6
5
.30 .10 DIA. (.012 .004) .40 .10 (.016 .004)
1.60 .15 (.063 .060)
.80 .10 (.031 .004)
For Standard Values Used in Capacitors, Inductors, and Resistors, click here.
DIMENSIONS ARE: MM (INCHES)
3.20 .15 (.126 .006)
.40 .10 (.016 .004)
1
2
3
4
Packaging Specifications
5000 pcs - per 7 " reel
1.9 .15 (.075 .006) 4.0 .10 (.157 .004) 2.0 .05 (.079 .002)
1.1 (.043)
13 0.5 DIA. (.512 .020) 60.0 1.0 DIA. (2.36 .039) 8.0 .05 (.138 .012) 21 0.5 (.827 .020) 12.5 2 (.492 .079) 178.0 2.0 (7.008 .080)
7.2 .20 (.283 .008)
3.5 .05 (.138 .002)
4.0 .10 (.158 .004)
1.5 +.10/-0 (.060 +.004/-0)
1.75 .10 (.069 .004)
10.0 1.5 (.394 .059)
Derating Curve
Rated power in percentage (%)
Land Pattern
Solder resist
100 80 60 40 20 0 -55 0 70 ( Ambient temperature C) 125
0.7 to 0.9 (.028 to .035)
Land
Chip resistor array CAT
2.0 to 2.2 (.079 to .087)
Schematic
8
R2 R1 R1 R1
0.4 to 0.45 (.016 to .0178)
0.80 (.032)
7
6
R2 R1
5
REV. 05/06
1
2
3
4
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.


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